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| PCB Material: | Woven Fiberglass Reinforced PTFE Laminates | Dielectric Constant: | 2.3 |
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| Layer Count: | Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB | Dielectric Thickness: | 31mil(0.787mm), 93mil (2.286mm), 125mil (3.175mm) |
| Copper Weight: | 1oz (35µm), 2oz (70µm) | Surface Finish: | Immersion Gold, HASL, Immersion Silver, Immersion Tin, Bare Copper, OSP, Pure Gold Plated Etc.. |
| High Light: | Woven Fiberglass Microwave PCB,PTFE Based Microwave PCB,125mil Rogers PCB Board |
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Rogers DiClad 870 Woven Fiberglass Reinforced PTFE-based 31mil 93mil 125mil Microwave PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
DiClad 870 laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. In comparison to nonwoven fiberglass reinforced PTFE-based laminates of comparable dielectric constants, the woven fiberglass reinforcement in DiClad 870 provides greater dimensional stability.
DiClad 870 laminates offer lower dielectric constants (Dk) and dissipation factors at a similar thickness as other laminates in the DiClad series by using fewer plies of woven fiberglass and a higher ratio of PTFE content.
Features & Benefits
1. Dielectric constant of 2.33 at 10GHz and 1 MHz
2. Dissipation factor of .0013 at 10GHz
3. Lowest moisture absorption among PTFE based composites
4. Stable Dk over a wide frequency range ensuring easy design transition and scalability of design
5. Low Dk supports wider line widths for lower insertion loss
6. Copper matched CTE in X and Y axis
7. Excellent outgassing value in TML, CVCM and WVR.
8. Meets requirements of UL94-V0
Our PCB Capability (DiClad 870)
| PCB Capability (DiClad 870) | |
| PCB material: | Woven Fiberglass reinforced PTFE Laminates |
| Designation: | DiClad 870 |
| Dielectric constant: | 2.3 |
| Layer count: | Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB |
| Dielectric thickness: | 31mil(0.787mm), 93mil (2.286mm), 125mil (3.175mm) |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Red, Yellow etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, Pure gold plated etc.. |
Typical Applications
1. Commercial Phased Array Networks
2. Digital Radio Antennas
3. Filters, Couplers, LNAs
4. Guidance Systems
5. Low Loss Base Station Antennas
6. Radar Feed Networks
Our Advantages
1. Wide ranges of high frequency materials: Rogers, Taconic, Wangling, Isola, Shengyi etc.
2. 16000㎡ workshop; 30000㎡ output capability per month; 8000 types of PCB's per month;
3. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
4. Quick CADCAM checking and free PCB quotation;
5. More than 20+ years of high frequency PCB experience;
6. Diversified shipping method: FedEx, DHL, TNT, EMS;
7. No MOQ, low cost for prototypes and small runs quantity;
8. Delivery on time: >98% ; Customer complaint rate: <1%
Appendix: Data sheet of DiClad 870
| Property | DiClad 870 | Condition | Test Method |
| Electrical Properties | |||
| Dielectric Constant @ 10 GHz | 2.33 | C23/50 | IPC TM-650 2.5.5.5 |
| Dielectric Constant @ 1 MHz | 2.33 | C23/50 | IPC TM-650 2.5.5.3 |
| Dissipation Factor @ 10 GHz | 0.0013 | C23/50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor @ 1 MHz | 0.0009 | C23/50 | IPC TM-650 2.5.5.3 |
| Thermal Coefficient of Er (ppm/°C) | -161 | -10°C to +140°C | IPC TM-650 2.5.5.5 Adapted |
| Volume Resistivity (MΩ-cm) | 1.5 x 10 9 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity (MΩ) | 3.4 x 10 7 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Arc Resistance | >180 | D48/50 | ASTM D-495 |
| Dielectric Breakdown (kV) | >45 | D48/50 | ASTM D-149 |
| Mechanical Properties | |||
| Peel Strength (lbs.per inch) | 14 | After Thermal Stress | IPC TM-650 2.4.8 |
| Tensile Modulus (kpsi) | 485(MD), 346(CD) | A, 23°C | ASTM D-638 |
| Tensile Strength (kpsi) | 14.9(MD), 11.2 (CD) | A, 23°C | ASTM D-882 |
| Compressive Modulus (kpsi) | 327 | A, 23°C | ASTM D-695 |
| Flexural Modulus (kpsi) | 437 | A, 23°C | ASTM D-790 |
| Thermal Properties | |||
| Coefficient of Thermal Expansion (ppm/°C) X Axis Y Axis Z Axis | 17 29 217 | 0°C to 100°C | IPC TM-650 2.4.24 Mettler 3000 Thermomechanical Analyzer |
| Thermal Conductivity (W/mK) | 0.257 | 100°C | ASTM E-1225 |
| Flammability UL | Meets requirements of UL94-V0 | C48/23/50, E24/125 | UL 94 Vertical Burn IPC TM-650 2.3.10 |
| Physical Properties | |||
| Density (g/cm3) | 2.26 | A, 23°C | ASTM D-792 Method A |
| Water Absorption (%) | 0.02 | E1/105 + D24/23 | MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 |
| Outgassing Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±) | 0.02 0.00 0.01 NO | 125°C, ≤ 10-6 torr | NASA SP-R-0022A Maximum 1.00% Maximum 0.10% |
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
